中文
EnglishLaser engraving machine is widely used in contemporary industrial production, from wood and paper marking to metal, mobile phone keys, high-end product production and processing process, marking and engraving are inseparable from laser engraving machine. With the improvement of market demand, adapting to various types of raw materials, laser cutting plotters are constantly being updated. Our laser cutting plotters have also experienced pure foreign introduction in the early 20th century and are now independently developed and produced.
The common name of laser engraving machine is laser engraving machine, laser engraving machine, laser marker, laser engraving machine and so on. But its professional name is called laser marking machine. Laser engraving machine can be divided into semiconductor laser engraving machine, YAG laser engraving machine, CO2 laser engraving machine, fiber laser engraving machine according to the different laser.
Laser cutting plotter (Kaitai laser) was introduced from abroad at the end of the 20th century. The initial laser cutting plotter models were only YAG laser cutting plotter and CO2 laser marking machine. In about 98 years, there were hundreds of laser cutting machines in China, and laser cutting machines were gradually accepted by people from this time. Later, the semiconductor laser was invented, and then the semiconductor laser engraving machine came one after another. With the continuous innovation of technology, the fiber laser was invented again, and the fiber laser engraving machine was also introduced. With the market demand for water-cooled CO2 laser engraving machine can not meet the market due to the large size, RF water-cooled CO2 RF laser engraving machine has been produced on demand. The semiconductor laser engraving machine has the largest market share. Because its price is moderate and the most widely used.
Two laser engraving methods
"Heat processing" laser beam with high energy density (it is a concentrated energy flow), irradiated on the surface of the processed material, the surface of the material absorbs the laser energy, and generates a thermal excitation process in the irradiation area, so that the surface of the material (or (Coating) temperature rises, causing metamorphosis, melting, ablation, evaporation and other phenomena.
"Cold processing" (ultraviolet) photons with high load energy can break the chemical bonds in the material (especially organic materials) or the surrounding medium, so that the material is destroyed by non-thermal processes. This kind of cold working has special significance in laser marking, because it is not thermal ablation, but it does not produce "heat damage" side effects and cold peeling that breaks the chemical bond, so it does not affect the inner layer and the surrounding area of the processed surface. Produce heating or thermal deformation. For example, in the electronics industry, an excimer laser is used to deposit a thin film of chemical substances on a substrate material, and a narrow groove is formed in a semiconductor substrate.
The common name of laser engraving machine is laser engraving machine, laser engraving machine, laser marker, laser engraving machine and so on. But its professional name is called laser marking machine. Laser engraving machine can be divided into semiconductor laser engraving machine, YAG laser engraving machine, CO2 laser engraving machine, fiber laser engraving machine according to the different laser.
Laser cutting plotter (Kaitai laser) was introduced from abroad at the end of the 20th century. The initial laser cutting plotter models were only YAG laser cutting plotter and CO2 laser marking machine. In about 98 years, there were hundreds of laser cutting machines in China, and laser cutting machines were gradually accepted by people from this time. Later, the semiconductor laser was invented, and then the semiconductor laser engraving machine came one after another. With the continuous innovation of technology, the fiber laser was invented again, and the fiber laser engraving machine was also introduced. With the market demand for water-cooled CO2 laser engraving machine can not meet the market due to the large size, RF water-cooled CO2 RF laser engraving machine has been produced on demand. The semiconductor laser engraving machine has the largest market share. Because its price is moderate and the most widely used.
Two laser engraving methods
"Heat processing" laser beam with high energy density (it is a concentrated energy flow), irradiated on the surface of the processed material, the surface of the material absorbs the laser energy, and generates a thermal excitation process in the irradiation area, so that the surface of the material (or (Coating) temperature rises, causing metamorphosis, melting, ablation, evaporation and other phenomena.
"Cold processing" (ultraviolet) photons with high load energy can break the chemical bonds in the material (especially organic materials) or the surrounding medium, so that the material is destroyed by non-thermal processes. This kind of cold working has special significance in laser marking, because it is not thermal ablation, but it does not produce "heat damage" side effects and cold peeling that breaks the chemical bond, so it does not affect the inner layer and the surrounding area of the processed surface. Produce heating or thermal deformation. For example, in the electronics industry, an excimer laser is used to deposit a thin film of chemical substances on a substrate material, and a narrow groove is formed in a semiconductor substrate.
